Wafer fabrication manufacturing facility 3D scanning Project, confidential client
DPS completed a Wafer Fabrication Manufacturing Equipment Installation project for a confidential client in Ireland over a 24 month period that required a full de-installation, upgrade and reinstallation of next generation process technology.
About This Project
DPS completed a Wafer Fabrication Manufacturing Equipment Installation project for a confidential client in Ireland over a 24 month period that required a full de-installation, upgrade and reinstallation of next generation process technology.
As part of the 300mm manufacturing equipment installation ramp, DPS executed 3D scanning of the facilities systems. The project incorporated the 3D scanning team to ‘clean the data’ and maintain an up-to-date 3D record. This allowed for the Trade Contractors to model through actual field conditions with tolerances of <3mm, enabling clash detection, the building of ISO’s and allowed for offsite fabrication take place. This project presented many challenges from congestion and complexity, to Intellectual Property (IP) and data volume. Due to the complexity and congestion of the site, DPS surveyors had to be highly experienced and trained to ‘translate’ the field conditions to meet customer needs.
Process / Support Systems
- Process specific support systems (chilled and high purity water; waste water treatment systems; general and process exhaust systems)
- Power distribution
- Instrumentation & Controls (I&C) and life support systems network infrastructure
- Bulk and spec gas distribution
- Chemical distribution
Facility Features
- 300mm Semiconductor Wafer Fabrication Facility
- 500K sq.ft. of Subfab (manufacturing equipment facilities support area)
- Live facility with ongoing construction activity
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